Warsaw Pack 2024

From April 23 to 25, 2024, our team participated in Warsaw Pack 2024, the 9th edition of the International Packaging Technology and Packaging Trade Fair held at Ptak Warsaw Expo. The event brought together leading players in the packaging sector, offering valuable insight into current innovations, sustainability trends, and strategic technological advancements shaping the industry. 

Our presence at this year’s Warsaw Pack was not incidental. It was a strategic decision built on more than a decade of experience in control processes and industrial system integration. With a clear understanding of how packaging directly influences product quality, safety, and logistics, we joined the fair to strengthen our position in this critical industry segment and foster meaningful partnerships. 

Strategic Focus and Objectives

We entered the fair with three main strategic goals that align with our long-term vision and technical expertise: 

  1. Technological Integration and Distribution

One of our primary objectives was to highlight our role as integrators and distributors of advanced Touchscreen and HMI components developed by Beijing DWIN Technology Co., Ltd. These interfaces are increasingly relevant for the packaging industry, offering enhanced control, user experience, and safety—without adding cost or complexity. Through a series of discussions and demonstrations, we engaged with machine manufacturers and solution providers to explore opportunities for integrating these technologies into their systems. 

  1. Exploring Synergies with Eslog System

The fair also provided a valuable platform to explore possible synergies between our Eslog System—a logistics and control solution—and modern packaging technologies. Our focus was particularly on the food and pharmaceutical industries, where traceability, quality control, and compliance are critical. These sectors offer significant potential for improving supply chain transparency and delivering reliable, verifiable data to end users. 

  1. Trial Launch and Sustainability Exploration

Another important goal was to announce the launch of Eslog System trials within packaging applications and initiate conversations around environmentally responsible packaging options. This aligns with our broader commitment to innovation and sustainable development. Identifying partners who share this mindset was a key outcome of the event. 

Observations from the Fair 

Warsaw Pack 2024 offered a comprehensive view of the future of packaging. The exhibition showcased a wide range of technologies—from smart labeling and automation to sustainable materials and integrated IoT systems. Among the key trends we observed: 

  • Increasing use of eco-friendly packaging solutions, driven by both regulation and consumer demand. 
  • Development of intelligent packaging systems that collect and share data across the supply chain. 
  • The growing importance of user interface technology in packaging machines, to improve usability and ensure compliance with safety standards. 

These trends align closely with our own development path and technological offering. The insights gathered during the fair have already begun to shape our next steps in product development and industry partnerships. 

Looking Ahead

Participation in Warsaw Pack 2024 was a strategic milestone that reinforced our commitment to delivering advanced, integrated, and responsible solutions to the packaging industry. We returned with a stronger network, new business leads, and actionable feedback that will inform both our ongoing Eslog trials and future technology partnerships. 

As packaging becomes more intelligent, traceable, and sustainable, we are excited to continue contributing our expertise and innovations to support that transformation.